图片仅供参考,产品以实物为准
| 规格书 |
 |
| Packaging | Bulk |
| Type | Backplane |
| Pitch | 2.54 mm |
| Number of Contacts | 300 |
| Termination Method | Press Fit |
| Mounting | Through Hole |
| Contact Plating | Gold Over Palladium Nickel |
| 类型 | Backplane |
| 触点数 | 300 |
| 端接方式 | Solder |
| 安装 | Through Hole |
| 触点电镀 | Gold Over Palladium Nickel |
| 标准包装 | Bulk |
| RoHSELV合规性 | RoHS compliant, ELV compliant |
| Lead Free Solder Processes | Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder c |
| 交配型 | Receptacle |
| 端子尾部电镀 | Tin over Nickel |
| 品牌 | AMP |
| 补强板材质 | Aluminum |
| 外壳材料 | Liquid Crystal Polymer (LCP) |
| PCB安装角度 | Right Angle |
| 引线长度（毫米（ ） ） | 3.12 [0.123] |
| 外壳颜色 | Black |
| PCB保持力特性 | No |
| 触点区域镀层材料 | Gold Flash over Palladium Nickel |
| 产品类型 | Connector |
| RoHSELV符合记录 | Always was RoHS compliant |
| 位置数 | 300 |
| 信号插座材料 | Phosphor Bronze |
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